| Product Type | Key Items | 2009 | 2010 | 2011 |
| Multilayer PCB(Rigid) | Max layer count | 36 | 40 | 40 |
| Line Width/spacing of inner layer(mil) | 3/3 | 2.5/2.5 | 2.0/2.0 | |
| Line Width/spacing of outer layer(mil) | 3/3 | 2.5/2/5 | 2.0/2.0 | |
| Max aspect ratio | 14:1 | 16:1 | 20:1 | |
| Min mechanical drill size(mil) | 4 | 4 | 4 | |
| Min spacing via to conductor(mil) | 5 | 5 | 5 | |
| HDI PCB | 1+c+1 | M | M | M |
| 2+C+2 | P | M | M | |
| 3+C+3 | P | S | S | |
| Min laser drill size(mil) | 4 | 3 | 3 | |
| Min pad size of laser hole(mil) | 10 | 9 | 8 | |
| Max aspect ratio(laser hole) | 1:1 | 1:1 | 1:1 | |
| Max aspect ratio(laser hole) | 1:1 | 1:1 | 1:1 | |
| Rigid Flex PCB | Max layer count | 16 | 18 | 29 |
| Line width/spacing of inner layer (mil) | 3/3 | 2.5/2.5 | 2/2 | |
| Line width/spacing of outter layer (mil) | 3/3 | 2.5/2.5 | 2/2 | |
| Max aspect ratio | 10:1 | 12.1 | 14:1 | |
| Min mechanical drill size (mil) | 6 | 4 | 4 | |
| Min spacing between via to conductor (mil) | 8 | 7 | 6 | |
| specials | Metal based PCB | Aluminium&Copper | Aluminium&Copper | Aluminium&Copper |
| Tolerance dor depth controlled board (mm) | +/-0.15 | +/-0.13 | +/-0.10 | |
| Embedded metal PCB | M | M | M | |
| Embedded resistance PCB | P | P | M | |
| Embedded capacitance PCB | P | P | M | |
| Impedance Controlled | 8% | 7% | 5% | |
| Heavy Copper (OZ) | 6 | 6 | 6 | |
| Epoxy plugging (Conductive) | P | M | M | |
| Epoxy plugging (non Conductive) | M | M | M |
Technical road map
